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| Place of Origin: | China |
| Nazwa handlowa: | JIMA |
| Orzecznictwo: | SGS, ISO,Reach, RoHS |
| Model Number: | EDCU-HC |
| Minimum Order Quantity: | 150kg |
|---|---|
| Cena: | negotiation |
| Packaging Details: | wooden carton |
| Delivery Time: | 5-25days |
| Payment Terms: | T/T, L/C |
| Supply Ability: | 1000 Ton per month |
| Purity: | 99.95% | Thickness: | 70um,35um |
|---|---|---|---|
| Color: | red or black | Standard: | IPC-4562 |
| Inter Diameter: | 76 Mm，152 Mm， 3 Inch，6 Inch | products name: | Electrolytic HTE Copper Foil with width 70um For PCB laminate |
| high temperature elongation copper foil: | 120 min (180 °C in Atmosphere) | ||
| High Light: | roll of copper foil,electrodeposited copper foil |
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Electrolytic HTE Copper Foil with width 70um For PCB laminate
Detail Specification:
| Single side treatment in red. and single Side Shiny |
| Thickness: 70um,35um |
| Width range: 5-1380mm,standard width:1290mm |
|
high temperature elongation copper foil :120 min (180 °C in Atmosphere) |
| Internal diameter: 3 inch/6 inch. |
| Standard :IPC-4562 |
Classify:
(STD-E)- standard electrodeposited copper foil.
(HD-E)-high ductility electrodeposited copper foil.
(HTE-E)-high temperature elongation electrodeposited copper foil.
Copper foil Application
| 1>PCB industry . | |
| Application | 2>PCB manufacture |
| 3>antenna PCB,Epoxy board | |
|
4>PCB laminate 5>Multi-layer printed circuit boards. |
Features and advantages
1.The thermally stable microstructures with their stable mechanical properties
2. improve dimensional stability
3.Reduce bulging, warping and nail head formation.
These resist thermal outliers which typically occur during laminates.
HTE ED copper foil Technical Terms (high elongation copper foil at high temperature).
| Thickness | um | 9 | 12 | 18 | 25 | 35 | 70 |
IPC 4562 4.6.3.1 |
|
| Area weight | g/m² | 80±1 | 107±3 | 153± | 215±5 | 285±5 | 585±8 |
IPC 4562 4.6.3.2 |
|
| Roughness | (RA) | μm | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 |
IPC 4562 4.6.9 |
| (RZ) | μm | <6.0 | <6.5 | <8.0 | <9.0 | ≤10.0 | <15 | ||
|
Copper≧ |
% | 99.8 |
IPC 4562 4.6.3.1 |
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| Tensile Strength | state normal | Mpa | >300 | >300 | >300 | >300 | >300 | >280 |
IPC 4562 4.6.4 |
| state temper (180℃) | Mpa | >15.0 | >18.0 | >18.0 | >18.0 | >18.0 | >18.0 | ||
| ElongationI | state normal | % | >3.0 | >3.0 | >5.0 | >6.0 | >10.0 | >10.0 |
IPC 4562 3.5.3 |
| state temper (180℃) | % | >2.0 | >2.5 | >2.5 | >3.0 | >5.0 | >5.0 | ||
| Peel strength | N/mm | >1.0 | >1.05 | >1.35 | >1.70 | >1.8 | >2.0 |
IPC 4562 4.6.7 |
|
|
High temperature oxidation resistance(200℃, 40min) |
No color change | Standard | |||||||
| Solderability | Good | Standard | |||||||
| Solderability | Good |
IPC 4562 4.6.12 |
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3. Standard Width,1295(±1)mm,May according to the customer request tailor.
We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp
Package detail:wooden box
Osoba kontaktowa: JIMA Annie
